Package and Manufacturing Method for an Electronic Device
444879
Electric Component with Under-Bump Metallization
444887
Package and Manufacturing Method for an Electronic Device
444879
Electric Component with Under-Bump Metallization
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経験
Senior Reliability Engineer
Silverbrook Research/ Memjet Australia
8月 2010 - 現在
Formulate reliability strategies for new products, materials, processes and products and execute/ monitor reliability tests
Design reliability monitoring tests that are compatible with a high volume manufacturing environment
Define reliability specifications of new products
Support yield improvement and process optimization activities
Product Development Reliability Manager
ST Microelectronics
2月 2009 - 8月 2010 (1 , 6 )
Plan and lead activities to define product specifications across different manufacturing sites
Plan and lead reliability programs for new products as part of product development
Develop test methodologies to determine acceleration factors and lifetime models for new products
Support plant-wide yield improvement and process optimization activities
Plan and lead reliability and failure analysis competency enhancement in support of new products
Establish in-house test facilities for new products and liais
Reliability Physics Manager
ST-NXP Wireless
8月 2008 - 2月 2009 (6 , 1 )
Plan and lead activities to define product specifications across different manufacturing sites
Plan and lead reliability programs for new products as part of product development
Develop test methodologies to determine acceleration factors and lifetime models for new products
Support plant-wide yield improvement and process optimization activities
Plan and lead reliability and failure analysis competency enhancement in support of new products
Establish in-house test facilities for new products and liais
教育
PhD Materials Science and Engineering
University of the Philippines, Philippines 2002 - 2007
(5 )
MS Materials Science and Engineering
University of the Philippines, Philippines 1996 - 1999
(3 )
BS Applied Physics
University of the Philippines, Philippines 1990 - 1995
(5 )
資格
6-Sigma Greenbelt
PerkinElmer Optoelectronics
2003
6-Sigma Greenbelt
ISO9001/TS16949
SGS
2003
Quality Systems certified auditor
出版物
A Comparative Study of the Effect of Bond Pad Opening on Solder Bump Reliability
Proceedings of 10th IPC/JEDEC International Pb-free Conference
A Comparative Study of the Effect of Bond Pad Opening on Solder Bump Reliability
Determination of Intermetallic Growth Activation Energy and the Effect of Time and Temperature on Shear Strength in Flip-Chip Devices
Proceedings of 9th IPC/JEDEC International Pb-free Conference
Determination of Intermetallic Growth Activation Energy and the Effect of Time and Temperature on Shear Strength in Flip-Chip Devices
High Density Optical Bit Data Storage in a Diarylethene Derivative Photochromic Material
Proceedings of ISOM 2000
High Density Optical Bit Data Storage in a Diarylethene Derivative Photochromic Material
Pulsed 1064 nm Nd-YAG Laser Deposition of Titanium on Silicon in a Nitrogen Environment
Science Diliman
Pulsed 1064 nm Nd-YAG Laser Deposition of Titanium on Silicon in a Nitrogen Environment
Thermal Aging Effects on Cu Ball Shear Strength and Cu/Al Intermetallic Growth
Journal of Electronic Materials
Thermal Aging Effects on Cu Ball Shear Strength and Cu/Al Intermetallic Growth
The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solders
Journal of Electronic Packaging
The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solders
Study of Thermal Aging Effects on Intermetallic Growth Mechanisms and Shear Strength Behavior of Wafer-Level Solder Bumps
IEEE Transactions on Components and Packaging Technologies
Study of Thermal Aging Effects on Intermetallic Growth Mechanisms and Shear Strength Behavior of Wafer-Level Solder Bumps
Characterization of a confocal Microscope Readout System in a Photochromic Polymer under Two-Photon Excitation
Japanese Journal of Applied Physics
Characterization of a confocal Microscope Readout System in a Photochromic Polymer under Two-Photon Excitation
3µm Layer Interval, 50 Layer, 3D Rewritable Digital Optical Data Storage
Proceedings of the Japan Society of Applied Physics
3µm Layer Interval, 50 Layer, 3D Rewritable Digital Optical Data Storage
Effect of Saturable Response to 2-Photon Absorption on the Readout Signal Level of 3-Dimensional Bit Optical Data Storage in a Photochromatic Polymer
Applied Physics Letters
Effect of Saturable Response to 2-Photon Absorption on the Readout Signal Level of 3-Dimensional Bit Optical Data Storage in a Photochromatic Polymer
High Density Optical Bit Data Storage in a Diarylethene Derivative Photochromic Material
Molecular Crystals and Liquid Crystals
High Density Optical Bit Data Storage in a Diarylethene Derivative Photochromic Material
Measurement of weak transmittances by stochastic resonance
Optics Letters
Measurement of weak transmittances by stochastic resonance